Job Description

Description AWS Utility Computing (UC) provides product innovations that continue to set AWS's services and features apart in the industry. As a member of the UC organization, you'll support the development and management of Compute, Database, Storage, Platform, and Productivity Apps services in AWS, including support for customers who require specialized security solutions for their cloud services. Additionally, this role may involve exposure to and experience with Amazon's growing suite of generative AI services and other cloud computing offerings across the AWS portfolio. Annapurna Labs (our organization within AWS UC) designs silicon and software that accelerates innovation. Customers choose us to create cloud solutions that solve challenges that were unimaginable a short time ago-even yesterday. Our custom chips, accelerators, and software stacks enable us to take on technical challenges that have never been seen before, and deliver results that help our customers change the world. Annapurna Labs is looking for a Sr. Packaging Engineer. As a senior member of the team, you will join a group of hardworking engineers to design and implement innovative next generation machine learning chips and servers. In this position, you will make a real impact in a dynamic, technology focused team. Your work will impact the growing field of machine learning. You will collaborate with architects, design teams, software engineers to deliver the next generation ML chip. In this position, you will have the opportunity to be responsible for IP integration, 2.5D design, bring up, Characterization and validation. Key job responsibilities

• Evaluation of packaging and assembly technology roadmap aligned to Annapurna product roadmap
• Engage with product architect and design teams on future products package and assembly needs
• Explore and provide recommendations on both available and future packaging and assembly technologies for Annapurna's products
• Engage with substrate and assembly vendors on future technologies roadmap

Product development and manufacturing:

• Define the substrate and package BOM of the ICs in collaboration with Package Design team and OSATs
• Assume full ownership of mechanical and thermal performance of Annapurna ICs
• In collaboration with HW Dev team optimize mechanical vs. thermal tradeoffs.
• Ensure testability of the ICs in collaboration with Test Engineer team
• Work with Assembly, Test and Logistics to define work flows at OSATs (focus on Fab/assembly/test interfaces)
• Track assembly and substrate yields and look for ways to improve them

About the team About the team Our team is dedicated to supporting new members. We have a broad mix of experience levels and tenures, and we're building an environment that celebrates knowledge-sharing and mentorship. Our senior members enjoy one-on-one mentoring and thorough, but kind, code reviews. We care about your career growth and strive to assign projects that help our team members develop your engineering expertise so you feel empowered to take on more complex tasks in the future. Diverse Experiences AWS values diverse experiences. Even if you do not meet all of the qualifications and skills listed in the job description, we encourage candidates to apply. If your career is just starting, hasn't followed a traditional path, or includes alternative experiences, don't let it stop you from applying. About AWS Amazon Web Services (AWS) is the world's most comprehensive and broadly adopted cloud platform. We pioneered cloud computing and never stopped innovating - that's why customers from the most successful startups to Global 500 companies trust our robust suite of products and services to power their businesses. Inclusive Team Culture Here at AWS, it's in our nature to learn and be curious. Our employee-led affinity groups foster a culture of inclusion that empower us to be proud of our differences. Ongoing events and learning experiences, including our Conversations on Race and Ethnicity (CORE) and AmazeCon conferences, inspire us to never stop embracing our uniqueness. Work/Life Balance We value work-life harmony. Achieving success at work should never come at the expense of sacrifices at home, which is why we strive for flexibility as part of our working culture. When we feel supported in the workplace and at home, there's nothing we can't achieve in the cloud. Mentorship & Career Growth We're continuously raising our performance bar as we strive to become Earth's Best Employer. That's why you'll find endless knowledge-sharing, mentorship and other career-advancing resources here to help you develop into a better-rounded professional. Basic Qualifications

• B.Sc. or M.Sc. degree in Electrical Engineering, Applied Physics or related fields
• 10+ years of professional experience in similar role

Engage with product architect and design teams on future products package and assembly needs

• Explore and provide recommendations on both available and future packaging, substrate and technologies for Annapurna's products.
• Engage with substrate and assembly vendors on future technologies roadmap.

Product development and manufacturing:

• Define the substrate and package BOM of the ICs in collaboration with Package Design team and OSATs.
• Ball maps and 3DIC C4/ubump studies
• Assume full ownership of mechanical and thermal performance of Annapurna ICs.
• In collaboration with HW Dev team optimize mechanical vs. thermal tradeoffs.
• Ensure testability of the ICs in collaboration with Test Engineer team.

Preferred Qualifications

• High communication skills
• Dive deep quickly into unfamiliar domains
• Strong analytic and problem-solving skills
• Ability to work independently on multiple issues
• Good understanding of transmission line theory, power delivery and signal integrity is desired.
• Strong programming and scripting skills in Perl, Python, Tcl desired, Cadence Skill and EXCEL familiarity are helpful.
• Enthusiastic and able to work with a minimum of supervision.
• Can solve complex technical problems.

Amazon is committed to a diverse and inclusive workplace. Amazon is an equal opportunity employer and does not discriminate on the basis of race, national origin, gender, gender identity, sexual orientation, protected veteran status, disability, age, or other legally protected status. Our inclusive culture empowers Amazonians to deliver the best results for our customers. If you have a disability and need a workplace accommodation or adjustment during the application and hiring process, including support for the interview or onboarding process, please visit for more information. If the country/region you're applying in isn't listed, please contact your Recruiting Partner.

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